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Pressure
Freescale Semiconductor High Volume Pressure Sensor for Disposable Applications
Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. NOTE:Freescale Semiconductor is also offering the Chip Pak package in application-specific configurations, which will have an "SPX" prefix, followed by a four-digit number, unique to the specific customer
MPX2300DT1 Rev 8, 04/2010
MPX2300DT1 MPX2301DT1
Pressure Sensors 0 to 300 mmHg (0 to 40 kPa)
Application Examples
* * * * * Medical Diagnostics Infusion Pumps Blood Pressure Monitors Pressure Catheter Applications Patient Monitoring
Features
* * * * * Low Cost Integrated Temperature Compensation and Calibration Ratiometric to Supply Voltage Polysulfone Case Material (ISO 10993) Provided in Easy-to-Use Tape and Reel
ORDERING INFORMATION
Device Name MPX2300DT1 MPX2301DT1 Package Options Tape and Reel Tape and Reel Case No. 423A 423A Gauge Pressure Type Differential * * Absolute Device Marking Date Code, Lot ID Date Code, Lot ID
CHIP PAK PACKAGE
MPX2300DT1/MPX2301DT1 CASE 423A-03
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes.
(c) Freescale Semiconductor, Inc., 2005, 2008, 2010. All rights reserved.
Pressure
The MPX2300DT1/MPX2301DT1 Pressure Sensors have been designed for medical usage by combining the performance of Freescale's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: 10993-5:1999, 10993-10:2002, and 1099311:1993. A silicone dielectric gel covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance of the sensor. The MPX2301DT1 is a reduced gel option.
MPX2300DT1 2 Sensors Freescale Semiconductor
Pressure
Maximum Ratings
Table 1. Maximum Ratings(1)
Rating Maximum Pressure (Backside) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 125 -25 to +85 +15 to +40 Unit PSI C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Operating Characteristics
Table 2. Operating Characteristics (VS = 6 Vdc, TA = 25C unless otherwise noted)
Characteristics Pressure Range Supply Voltage(1) Supply Current Zero Pressure Offset Sensitivity Full Scale Span(2) Linearity + Hysteresis Accuracy(9) Accuracy
(9) (3)
Symbol POP VS Io Voff -- VFSS -- -- -- TCS TCVFSS TCVoff Zin Zout RCAL tR -- --
Min 0 -- -- -0.75 4.95 2.976 -1.5 -1.5 -3.0 -0.1 -0.1 -9.0 1800 270 97 -- 0 --
Typ -- 6.0 1.0 -- 5.0 3.006 -- -- -- -- -- -- -- -- 100 1.0 -- 0.5
Max 300 10 -- 0.75 5.05 3.036 1.5 1.5 3.0 +0.1 +0.1 +9.0 4500 330 103 -- 85 --
Unit mmHg Vdc mAdc mV V/V/mmHg mV %VFSS % % %/C %/C V/C mmHg ms C %VFSS
VS = 6 V, P = 101 to 200 mmHg VS = 6 V, P = 201 to 300 mmHg
Temperature Effect on Sensitivity Temperature Effect on Full Scale Span(4) Temperature Effect on Offset Input Impedance Output Impedance RCAL (150 k)(6) Response Time (10% to 90%)
(7) (5)
Temperature Error Band Stability
(8)
1. Recommended voltage supply: 6 V 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above +10 V may induce additional error due to device self-heating. 2. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference between full scale output and zero pressure offset. 3. Maximum deviation from end-point straight line fit at 0 and 200 mmHg. 4. Slope of end-point straight line fit to full scale span at 15C and +40C relative to +25C. 5. Slope of end-point straight line fit to zero pressure offset at 15C and +40C relative to +25C. 6. Offset measurement with respect to the measured sensitivity when a 150 k resistor is connected to VS and S+ output. 7. For a 0 to 300 mmHg pressure step change. 8. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +10C to +85C after: * 1000 temperature cycles, -40C to +125C. * 1.5 million pressure cycles, 0 to 300 mmHg.
MPX2300DT1 Sensors Freescale Semiconductor 3
Pressure
PACKAGE DIMENSIONS
A M C L N
F B
123
4
V K DETAIL A
D1 G H FRONT VIEW E
-TJ
END VIEW AC F AA AB
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MILLIMETERS MIN MAX MIN MAX 0.240 0.260 6.10 6.60 0.350 0.370 8.89 9.40 0.140 0.150 3.56 3.81 0.012 0.020 0.30 0.51 0.014 0.022 0.36 0.56 0.088 0.102 2.24 2.59 0.123 0.128 3.12 3.25 0.045 0.055 1.14 1.40 0.037 0.047 0.94 1.19 0.007 0.011 0.18 0.28 0.120 0.140 3.05 3.56 0.095 0.105 2.41 2.67 0.165 0.175 4.19 4.45 0.223 0.239 5.66 6.07 0.105 0.115 2.67 2.92 0.095 0.107 2.41 2.72 0.015 0.035 0.38 0.89 0.120 0.175 3.05 4.45 0.100 0.115 2.54 2.92
AD D2 DETAIL A BACK VIEW
STYLE 1: PIN 1. 2. 3. 4.
VCC +OUT -OUT GROUND
CASE 423A-03 ISSUE C CHIP PAK PACKAGE
MPX2300DT1 4 Sensors Freescale Semiconductor
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Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2010. All rights reserved.
MPX2300DT1 Rev. 8 04/2010

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